Heat exchangers, widely used in heaters, refrigeration, air conditioning, power plants, chemical plants, petrochemical plants, oil refinery, natural gas processing, and wastewater treatment, are usually manufactured with materials with high thermal conductivity coefficient, such as copper and aluminum. However, synthetic diamonds have a better thermal conductivity performance and are not applied in heat exchangers because of the high value and the difficulty of forming the material in desired shapes.
The developed invention consists of the application of thin diamond films as heat exchangers in steam condensers and refrigeration equipments. The use of the developed process promotes greater thermal conductivity and more thermal efficiency than copper and aluminum exchangers, which are the metals commonly used for this purpose, with reduced use of synthetic diamond to confer greater economic viability of the process.