The technology of slim films and semiconductors became very important in modern industry, since many electronic devices functions because of this technology applied to semiconductors. Different technologies are used by the industry for deposit of slim films, being the SILAR, dip-coating and electro-deposition the highlighted techniques. Each of this perform the formation of slim films in different ways, varying the precursor and the chemical reactions that occurs in the process. This new technique executes the early mentioned deposition techniques in the same equipment and in the same sample, allowing to deposit different material layers and with different techniques, in a totally automatic way.
This new technique allow the deposition of slim films in an automatic way, executing the SILAR, dip-coating and electro-deposition techniques in a single equipment and sample, benefiting the deposition of different material layers, with different techniques, such as the application of hybrid techniques using various materials in the same time.
Agência Unesp de Inovação
Tel: +55 11 5627.0696
Carlos F. De Oliveira Graeff
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